Inspection Technologies. 2. Visual Inspection Technologies for Solder Joint.
نویسندگان
چکیده
منابع مشابه
Visual inspection scheme for use in optical solder joint inspection system
An optical solder joint inspection system(0SIIS) has been developed for the automatic visual inspection of soldered parts on the printed circuit boards. Its advantages over existing techniques include the detection of 3-0 shape of specular objects with high reliable and high speed. In this paper, we will propose a solder joint inspection scheme for a prototype of the OUIS. The inspection scheme...
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This paper describes the design and construction of an open automated solder bond veri cation machine for the electronics manufacturing industry The application domain is the higher end assembly technologies with an emphasis on ne pitch surface mount components The system serves a measurement function quantifying the solder bonds It interfaces with the manufacturing process to close the manufac...
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This paper reports, for the first time, the use of endoscopy for the nondestructive examination of solder joint integrity in chip scale packages (CSP) such as flip chip on flex (FCF). Borrowed from the medical instrument technology, the endoscope is used to examine visually the inside of an organ. This concept has now been developed and refined by ERSA and KURTZ, and led to an ERSASCOPE inspect...
متن کاملAutomated Visual Inspection Algorithm for Solder Joint of Surface Mount Devices Based on Three Dimensional Shape Analysis
An automated visual inspection system has been developed for use with surface mount devices (SMDs) on a printed circuit board (PCB). The system is capable of inspecting minute solder joints of fine pitch components as small as 0.3mm pitch QFP leads. A solder joint is judged using a height image and an intensity image that are detected by a unique confocal height sensor. A solder joint is classi...
متن کاملDesign of automatic vision-based inspection system for solder joint segmentation
Purpose: Computer vision has been widely used in the inspection of electronic components. This paper proposes a computer vision system for the automatic detection, localisation, and segmentation of solder joints on Printed Circuit Boards (PCBs) under different illumination conditions. Design/methodology/approach: An illumination normalization approach is applied to an image, which can effective...
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ژورنال
عنوان ژورنال: The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
سال: 1995
ISSN: 1884-1201,1341-0571
DOI: 10.5104/jiep1995.10.482